Species

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                                                                                            Capability
                    Layer1-24LMin.   finished thickness(2L)0.3mm
                    Max. panel size635×1120mmMin.   finished thickness(multilayer)0.4mm
                    Max. Cu thickness5OZMax.   finished thickness4.0mm
                    Min.Cu thickness(base)1/3OZMin.   core thickness0.1mm
                    Max.Cu thickness(base)5OZDrilling   hole to hole tolerance±0.05mm
                    Aspect ratio10:1Min.   hole diameter tolerance (PTH)±0.075mm
                    Etching tolerance±10%Min.   hole diameter tolerance (NPTH)±0.05mm
                    Min.line with0.075mm(3mil)Min.   routing tolerance±0.10mm
                    Min.line space0.075mm(3mil)Min.   stamping edge to edge tolerance±0.075mm
                    Min. hole diameter0.20mmV-cut   edge to edge tolerance±0.10mm(4mil)
                    Board bow and twist≤   0.75%Registration(O/L)±0.05mm(2mil)
                    Impedance tolerance±10%Paterning   positioning tolerance±0.075mm(3mil)
                    Hole copper thickness30umMax.test   points/Board(universal ET)Jig Test Fixture:15000
                        Flying Probing:1-∞
                    Surface finishHAL-LF,HASL,Immersion Gold,Immersion Silever,OSP
                    Base materialFR-4,   Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards
                    Standard lead timeMultilayer:9   wds,2L:7wds,sample:3-6wds



                    Product information
                    Product name Product picture Product parameters
                    PTFE laminate - Multilayer
                    Traditional antenna PCB
                    应用领域:LED照明

                    板材:铝基

                    层数:1L

                    板厚:0.8mm

                    完成铜厚1OZ

                    表面处理:OSP

                    应用领域:LED照明

                    板材:铝基

                    层数:1L

                    板厚:1.2mm

                    完成铜厚1OZ

                    表面处理:OSP

                    应用领域:LED照明

                    板材:铝基

                    层数:1L

                    板厚:1.5mm

                    完成铜厚1OZ

                    表面处理:OSP

                    Application field: automotive power supply

                    材质: FR4

                    层数: 8L

                    板厚: 2.0mm

                    铜厚: 4Oz

                    最小孔径: 0.9mm

                    表面处理: 无铅喷锡

                    特性: 厚铜



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